About

Brandon Brea is a Failure Analysis Engineer currently working at Qualcomm. With a relevant experience of 3.45 years, Brandon has a strong background in research and process engineering. He has previously worked as a Process Engineering Intern for Diffusion and Cleans at On Semiconductor and as a Research Assistant at Wilkes University. Brandon has completed his education from Wilkes University, Pennsylvania, United States, where he pursued his Bachelor's degree in Research Science. During his tenure at Wilkes University, he gained extensive knowledge in research methodology, data analysis, and project management. He has also developed a strong understanding of the principles of failure analysis and has applied them to solve complex engineering problems. As a Failure Analysis Engineer at Qualcomm, Brandon is responsible for analyzing and identifying the root cause of failures in the company's products. He uses his expertise in research and data analysis to develop effective solutions and improve the overall product quality. He works closely with cross-functional teams to ensure that the products meet the company's standards and customer requirements. Brandon's technical skills include research methodology, data analysis, project management, and failure analysis. He has a strong understanding of the latest tools and technologies used in the industry and is always looking for ways to improve his skills. He is a quick learner and is always willing to take on new challenges. In summary, Brandon Brea is a highly skilled and motivated Failure Analysis Engineer with a strong background in research and process engineering. He has a proven track record of delivering high-quality solutions and is committed to continuous learning and improvement.