About

Farzam Roknaldin is a highly experienced Senior Staff Thermal System Engineer with over 22 years of relevant experience. Currently, he is working at Qualcomm as a Senior Staff Thermal System Engineer, where he is responsible for developing thermal solutions for mobile devices. In this role, he ensures that the thermal design meets the performance and reliability requirements of the product. Prior to joining Qualcomm, Farzam worked at Panasonic Avionics Corporation as a Principal Thermal and Structural Engineer. In this role, he was responsible for designing thermal solutions for in-flight entertainment systems. During his tenure at Panasonic, he gained extensive experience in designing thermal solutions for complex systems. Before joining Panasonic, Farzam worked at Aavid Thermalloy as a Principal Thermal Engineer. Here, he designed and developed thermal solutions for various industries, including automotive, medical, and telecommunications. He also provided technical guidance to the design and manufacturing teams, ensuring that the products meet the customer's requirements. Farzam holds a degree in Mechanical Engineering from Stanford University, where he graduated in 2001. During his time at Stanford, he gained a strong foundation in engineering principles and developed a passion for solving complex engineering problems. He is a highly skilled engineer with a deep understanding of thermal design and analysis. Overall, Farzam is a dedicated and experienced engineer with a proven track record of delivering high-quality thermal solutions. He is a valuable asset to any organization and is always looking for new challenges to further develop his skills.