About

Fiona Cui is a highly skilled hardware development engineer with over 6 years of relevant experience. Currently, she works at Apple as a Hardware Development Engineer - Display Module Process, where she is responsible for developing and improving the display module process. Her previous role at Apple was as a Failure Analysis Engineer Intern, where she gained valuable experience in analyzing and resolving issues related to hardware failures. Fiona holds a Ph.D. in Fracture Toughness Testing Design from Lehigh University, where she also worked as a Research Scientist. During her time at Lehigh, she developed a strong foundation in testing and designing fracture toughness, which has been instrumental in her current role at Apple. In addition to her Ph.D., Fiona also holds a Bachelor's degree from Harbin Institute of Technology in China. Her education and experience have given her a deep understanding of hardware development and testing, making her an asset to any team. Fiona's technical skills include test and research scientist, and she is well-versed in a variety of tech stacks. Her experience and education have given her a unique perspective on hardware development, and she is always looking for new and innovative ways to improve processes and products. Overall, Fiona Cui is a highly skilled and dedicated hardware development engineer with a passion for innovation and a proven track record of success. Her experience at Apple and Lehigh University has given her a broad range of skills and expertise, making her an asset to any team.