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H

Hariom Dhakad

Senior Lead Engineer at Qualcomm

About

Hariom GS Dhakad is a highly skilled Senior Software Engineer at Qualcomm with over 7 years of relevant experience in the field. He has an impressive grip on C, Data structure, Unix system programming, kernel programming, Device driver development, Unix shell scripting, Python, and Assembly. He also has hands-on experience of Multi-threading, process management, Memory Management, signal and interrupt handling in Linux/QNX environment. In addition to his strong technical skills, Hariom has a solid understanding of deep learning and neural networks. He has worked on OS and Bootloader porting for TI Sitara processor and has hands-on work experience of target power optimization on Qualcomm snapdragon 8909 processor for windows and Android mobile phone. He has also worked on Intel Galileo (yocto embedded OS), Beaglebone black, Raspberry pi, Cubietruck 3 and Radaxa Rock. Hariom has previously worked as an Embedded Engineer at Qualcomm and as a Lead Engineer at HCL. At Qualcomm, he was responsible for optimizing the power consumption of windows and android mobile platform without compromising with performance. At HCL, he worked on C, C++, Multi-threading, OS and bootloader porting, system programming, Shell and python scripting. He also has experience in Linux device driver PCI Ethernet, USB, Char, Block, process management, memory management, network management, Subnetting, Vlan, VTP, Switching, Routing, TCP/IP, UDP, and more. Hariom holds a Master of Science in Embedded Systems from Manipal Academy of Higher Education and a Bachelor’s Degree in Electrical, Electronics and Communications Engineering from RGTU Bhopal. Overall, Hariom is a highly skilled and experienced Senior Software Engineer with a strong background in software engineering, deep learning, neural networks, mobile, and Android. He is a valuable asset to any team and is always looking for new challenges to further develop his skills.

Education Overview

manipal academy of higher education

sri dadaji institute of technology science rehmapur khandwa dist. east nimar450001

Companies Overview

qualcomm

hcl

moschip

Experience Overview

9.1 Years

Experience

Q

Senior Lead Software Engineer

qualcomm | Bengaluru, Karnataka, India

2017 - Present

Q

Engineer

qualcomm | Chennai Area, India

2017 - 2018

H

Lead Engineer

hcl | Chennai Area, India

2016 - 2017

M

Firmware Engineer

moschip | Hyderabad Area, India · On-site

2015 - 2016

Skills

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Android
architecture
Artificial Intelligence (AI)
Communication
Design
Ethernet
firmware
Graphics
Integration
Kernel
linux
Manufacturing
Mobile
Networking
optimization
Prototyping
Python
Real-Time Operating Systems (RTOS)
RTOS
soc
test
testing
Unix
Wireless

Education

M

manipal academy of higher education

Master of Science in Embedded Systems

2013 - 2015

S

sri dadaji institute of technology science rehmapur khandwa dist. east nimar450001

Bachelor’s Degree

2009 - 2013

Frequently asked questions

What company does Hariom Dhakad work for?

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Hariom Dhakad works for qualcomm

What is Hariom Dhakad role in their workplace?

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Hariom Dhakad's role in their workplace is Senior Lead Software Engineer

What is Hariom Dhakad's tenure in their workplace?

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Hariom Dhakad's tenure in their workplace is 7.75 years

What is Hariom Dhakad's total experience?

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Hariom Dhakad's total experience is 9.08 years

What is Hariom Dhakad's LinkedIn profile?

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Hariom Dhakad's LinkedIn profile can be found here

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Hariom Dhakad's email address is harXXXXXXXXXXXXom. Unlock here

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Hariom Dhakad's phone number is +91XXXXXXXX85. Unlock here

What schools did Hariom Dhakad attend?

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Hariom Dhakad has attended manipal academy of higher education, sri dadaji institute of technology science rehmapur khandwa dist. east nimar450001

What companies has Hariom Dhakad worked with?

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Hariom Dhakad has worked with qualcomm, qualcomm, hcl, moschip

What are some of Hariom Dhakad's skills?

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Hariom Dhakad has skills in Android, architecture, Artificial Intelligence (AI), Communication, Design, Ethernet and more.

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