About

Kuldeep Singh is a highly skilled Sr. PCB Design Engineer with over 8 years of experience in the field. He is currently working at Bharat FIH Ltd. where he is responsible for PCB Layout for Smart Phone, 4G & 2G Feature Phone, Smart Watch & Electric Vehicle (EV). He has extensive experience in designing PCB Layout for Highspeed Signal, Audio signal, Video signal, RF Signal, Analog, Digital & Power section. Kuldeep has a strong background in Length Matching, Impedance Matching, Diff. pair routing of signal, Blind & Buried Vias & Micro via. He also has experience in Multi Layer PCB Layout Design, PCB Layout with Mediatek (MTK) & Unisoc Processor, and PCB’s design using high-density interconnect (HDI) techniques. He is proficient in designing PCB Layout with fine pitch BGA 0.4 mm & 0.06 MM trace width & spacing. Kuldeep has knowledge and experience in PCB layout with interfaces like LPDDR3/4, eMMC, USB, SD Card, RF IC (GPS, GPRS, 2G,3G, LTE, 4G & NB/IOT IC), Wi-Fi 5.0, Bluetooth 5.0, Camera, Speaker, Receiver, Sensors, LCD Display, HDMI & Ethernet. Prior to his current role, Kuldeep worked as a Sr. PCB Design Engineer at Lava International where he was responsible for PCB Layout Designing for Smart Phone & Feature Phone. He also worked at Sumer Verde Pvt. Ltd. as a Printed Circuit Board Design Engineer where he was responsible for designing Single Phase Smart Energy Meter PCB Layout with 4 Layer satck up, Three Phase Smart Energy Meter PCB Layout with 4 Layer satck up, PCB Layout Designing for E-Rickshaw Charger and Industrial Panel Meter PCB design. Kuldeep holds a B.Tech degree in Electronics and Communications Engineering from MDU. He is highly skilled in Mobile technology and has relevant experience of 8.77 years.