About

Menglu Li is an experienced IC packaging engineer currently working at Qualcomm. With over 12 years of relevant experience, Menglu has gained a wealth of knowledge and expertise in the field of IC packaging. Menglu began her career as a research assistant at UCLA, where she gained valuable experience in the research and development of new IC packaging technologies. She then went on to work at Apple as an IC packaging engineer, where she worked on the design and development of cutting-edge IC packaging solutions for a range of Apple products. In her current role at Qualcomm, Menglu is responsible for the design and development of advanced IC packaging solutions for a range of Qualcomm products. She works closely with cross-functional teams to ensure that her designs meet the highest standards of quality and reliability. Menglu has a strong educational background, having studied at both the University of California and Shanghai Jiao Tong University. She holds a Bachelor's degree in Electrical Engineering from Shanghai Jiao Tong University and a Master's degree in Electrical Engineering from the University of California, Los Angeles. In addition to her academic and professional experience, Menglu is also highly skilled in a range of technical areas. She has experience as a research scientist and is proficient in a range of technical tools and technologies. Overall, Menglu is a highly skilled and experienced IC packaging engineer with a proven track record of success. She is dedicated to her work and is committed to delivering high-quality solutions that meet the needs of her clients and customers.