About

Pavan Rajmane is a highly skilled Senior Packaging Engineer with over 5 years of relevant experience in the field. Currently working at Qualcomm, Pavan has honed his skills in developing and designing innovative packaging solutions for various products. Pavan started his career as a Graduate Research Assistant at The University of Texas at Arlington, where he gained valuable experience in research and development. He then moved on to become a Postdoctoral Researcher at the same institution, where he focused on developing new packaging solutions for electronic products. Pavan's educational background includes a Ph.D. in Materials Science and Engineering from The University of Texas at Arlington, as well as a Bachelor's degree in Engineering from the Department of Technology, Savitribai Phule Pune University. He also holds a Master's degree in Materials Science and Engineering from The University of Texas at Arlington. Pavan's technical expertise includes research and development, materials science, and engineering. He has a strong background in working with various materials and processes, including ceramics, polymers, and metals. He is also experienced in using various software tools for simulation and modeling. Throughout his career, Pavan has demonstrated exceptional problem-solving skills and the ability to work independently and as part of a team. He is a highly motivated individual with a passion for innovation and a commitment to delivering high-quality work. His experience and expertise make him a valuable asset to any organization in need of a Senior Packaging Engineer.