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Building Dropo – a platform that optimizes dark store placements and enhances delivery efficiency for quick-commerce businesses. Join me as we revolutionize logistics and make fast, efficient deliveries the norm. Let’s shape the future of quick-commerce together!

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Tenha o ERP do seu jeito, em alguns dias, com seus dados, suas consultas, seus processos, e suas integrações.

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Entregamos a solução do seu jeito em poucos dias, com o custo de soluções de prateleira, e com a capacidade de personalização de fábricas de software.

PhD|CEO and Co-Founder at Ossus Biorenewables|Renewable Energy Scientist|ene Top 10 Women Entrepreneurs, WEQ-GHCI 2018

Suruchi Rao

Co-founder at Ossus | One Young World Scholar 23’ | Sir David Gosling Awardee 20’

Kamar Suhail Basha

Driven Scientist | Academic Standout | Passionate about Research and Development

Priyadharshini Chandrasekaran

Head of Product at Ossus Biorenewables

sai swaroop

Rainmatter Foundation

Gruhas

We are a bioenergy company, utilizing the chemical content of oil and gas industry effluents as a source of decentralized power.

Provider of microbial cell solution for hydrogen production from wastewater treatment

We're #hiring a new Electrical and Instrumentation Technician in Bengaluru, Karnataka. Apply today or share this post with your network.

Ossus Biorenewables

We're #hiring a new Client Management Specialist in Bengaluru, Karnataka. Apply today or share this post with your network.

We're #hiring a new Mechanical Design Engineer in Bengaluru, Karnataka. Apply today or share this post with your network.

We're #hiring a new Assistant Manager Finance in Bengaluru, Karnataka. Apply today or share this post with your network.

We're #hiring a new Operations Associate internship in Bengaluru, Karnataka. Apply today or share this post with your network.

We're #hiring a new Electrical Technician in Bengaluru, Karnataka. Apply today or share this post with your network.

We're #hiring a new PLC Programmer in Bengaluru, Karnataka. Apply today or share this post with your network.

🌿 Join Ossus Biorenewables: Power the Future with Green Hydrogen! 🌿 Are you passionate about engineering and eager to make a tangible impact on the environment? Ossus Biorenewables, a leading green hydrogen company in India, is on the hunt for innovative PLC Engineers to join our dynamic team! 🌍 Why Ossus? At Ossus, we're at the forefront of the green energy revolution, dedicated to creating sustainable solutions that combat climate change. Our green hydrogen technology plays a pivotal role in reducing carbon emissions and advancing India's clean energy goals. What You'll Do: 🔧 Design, implement, and optimize PLC systems for cutting-edge green hydrogen production processes. 🔍 Collaborate with a passionate team of engineers to innovate and refine technologies that drive sustainability. 🌟 Contribute directly to a greener planet, enhancing our energy systems and supporting global climate initiatives. Why This Matters: Green hydrogen is more than just a fuel—it's a game-changer for reducing greenhouse gas emissions and transitioning to renewable energy sources. By joining our team, you'll be part of a mission to: 🚀 Reduce Industrial Emissions: Your expertise will help in minimizing emissions from production processes. 🔋 Boost Renewable Energy Use: Facilitate the integration of green hydrogen into various sectors, from transportation to energy storage. 🌱 Promote Sustainable Development: Support global efforts in creating a more sustainable and eco-friendly future. If you’re a PLC Engineer ready to drive change and work on technologies that matter, we want to hear from you! 🌟 👉 Apply Now and be a part of our journey towards a cleaner, greener future. Send your resume to [ people@ossusbio.com ] and help us shape the future of energy! Together, we can make a world of difference. 🌏💚 #GreenHydrogen #Sustainability #Engineer

Automation Machinery Manufacturing

Siemens

Software Development

Solido Custom IC Solutions (Siemens EDA)

Helping customers achieve 1st pass Silicon success

Rajat Mohan

Deep Tech Business Developer | Co-founder Siemens Cre8Ventures.

Carson Bradbury

Philippe Rossant

Hazem EL Tahawy

US Department of Energy

Siemens EDA, a segment of Siemens Digital Industries Software, is a technology leader in software and hardware for electronic design automation (EDA). Siemens EDA offers proven software tools and industry-leading technology to address the challenges of design and system level scaling, delivering more predictable outcomes when transitioning to the next technology node. With a closed-loop digital twin managing the silicon lifecycle, data can move freely between design, manufacturing and the cloud for chips, boards and electrical and electronic systems. Our commitment to openness and industry alliances facilitates collaboration and interoperability across the EDA and electronics ecosystem -- Siemens is where EDA meets tomorrow.

Simcenter Culgi computational chemistry software accelerates material development in domains such as pharmaceutical development and cosmetic development.

Ready for a solution for fast-tracking Ethernet chipset design and development? ⏩ In response to the growing demands for high-speed Ethernet solutions, we've collaborated with Spirent Communications to deliver a sophisticated pre-silicon test solution for Ethernet chipset design verification. The joint networking system-on-chip (SoC) verification solution aims to reduce complexity and accelerate the silicon development lifecycle, paving the way for faster Ethernet chip development tailored for uses such as data center AI networking and service provider core and edge. 🤝 Benefits include reduced testing complexity and accelerated Ethernet chipset design and development. “We’re excited to work with Siemens to bridge the gap between pre- and post-silicon validation, providing customers with an integrated, end-to-end solution,” said Aniket Khosla, Spirent’s vice president of Wireline Product Management. “Siemens is an innovator in hardware-assisted verification, and this latest collaboration offers cutting-edge IC design verification tools that empower customers to address critical issues early in the design process, accelerating time to market. This joint solution simplifies Ethernet chipset design and testing, reduces development time, and ensures new products meet expected performance standards.” “The ever-demanding networking market has driven significant innovation in the virtualization of hardware emulation,” said Jean-Marie Brunet , our vice president and general manager, Hardware-Assisted Verification. “The certification of Veloce software for Spirent TestCenter Virtual is based on a long-term collaboration delivering high performance system-level test solutions for bleeding edge networking customers.” All the details of this exciting update are in our news story: https://sie.ag/5CqgqK #Collaboration #News #SOCVerification

Siemens EDA (Siemens Digital Industries Software)

Great #news ! 📣 Our continued collaboration with longtime customer Samsung Foundry has resulted in a set of new certifications for our new Solido SPICE software, which supports the verification of next-generation analog, mixed-signal, RF, memory, library IP and 3D-IC semiconductor designs. With these certifications, mutual customers using Solido SPICE (part of our Solido Simulation Suite software) will have access to the enhanced performance, power efficiency and scalability of Samsung Foundry’s leading edge process technologies, providing the tools required to innovate and thrive in multiple high-tech industries. "Siemens’ long and prolific collaboration with Samsung Foundry continues to help our joint customers deliver highly innovative and differentiated integrated circuits (ICs),” said Amit Gupta , our vice president and general manager, Custom IC. “Siemens is pleased to extend this cooperation with these recent certifications for Samsung’s newest and most advanced semiconductor process technologies." “Samsung Foundry is known for extending semiconductor physics to new heights with each technology transition,” said Hyung-Ock Kim, vice president and head of Foundry Design Technology Team, Samsung Electronics . “Our collaboration with Siemens plays a critical role in our ecosystem to help ensure EDA verification enablement is in lock-step throughout the innovation journey. I am pleased that Samsung Foundry has certified Siemens’ newly released Solido SPICE across a broad range of process technologies, empowering IC developers to robustly and accurately verify their complex ICs targeted for high-growth applications and markets.” For all the specific certification information, please check the comments for a link to the #newsroom ! #SamsungFoundry #CustomIC #EdgeProcessing

Companies around the globe are constantly striving to work more efficiently in order to bring their products to their customers more quickly. As a trusted service provider to large enterprise customers such as Asus, Xiaomi, Murata and Epsom, PT Sat Nusapersada Tbk (PTSN) , one of Indonesia's largest providers of electronics manufacturing services (EMS) understands this imperative very well. ⏱️ The company has recently expanded its surface mount technology lines to 24, and this increase of production capacity called for a need to reduce manual work, particularly during the process of new product introduction. To help with that, Sat Nusapersada implemented our Process Preparation software, to help them keep assembly, test and inspection data up to date in a single environment for all stages of the surface mount technology (SMT) manufacturing process. This dramatically reduces the need for manual, error-prone updates, which can cause consistency and reliability issues. What has been the impact? 🎯 After implementation, Sat Nusapersada has benefited from a 70% reduction in time needed to gather all the incoming data for projects while improving line efficiency by 23%. Use of Siemens Process Preparation has also helped Sat Nusapersada reduce SMT programming tasks by 21% (line configuration setup, common feeder, data output/transfer, move existing product between lines of different equipment brands). The design time needed for solder stencils was reduced by 30% by leveraging the learning libraries that automatically set the correct aperture shape and size to new footprints. “We have achieved significant increases to our production capacity with the introduction of Siemens’ Process Preparation which, when combined with decreases in manual rework, we’re able to better serve our customers and bring them their critical electronics in the timescales that today’s industry demand,” said Stanly Rocky, Asst General Manager of Public Relations, Sat Nusapersada. “it’s great to see the benefits that Sat Nusapersada have gained from implementation of Siemens’ Process Preparation and how it is benefitting from improved efficiency in its SMT production lines,” said Alex Teo , our managing director and vice president, South East Asia. “Our success is the region is centered on enabling our customers to not only innovate their own products, but to scale up the production lines for an increased global demand for electronics.” To learn more about this announcement, check the comments for the link to our newsroom. ⬇️ #efficiency #manufacturing #software

Systems design—spanning from IC design and manufacturing to IC packaging and board design to embedded software—has been constantly evolving over the past decades, and so have toolsets that serve these vital tenets of electronics. Siemens EDA’s next-generation electronic systems design software takes an integrated and multidisciplinary approach to cater to this changing landscape. It’s built on five pillars: •Intuition •AI •Cloud •Integration •Security Check out the link in the comments for a closer look at the key building blocks of this unified solution and how it can help engineers to tackle challenges head-on.

Just announced 📣: Another step forward to better enabling advanced capabilities for software-defined vehicles (SDVs) through our ongoing collaboration with Infineon Technologies , which will help automotive OEMs achieve production readiness to deliver the next generation of capabilities required by SDVs! How? We're combining our embedded automotive software platform (based on the AUTOSAR Classic platform R20-11) with Infineon's AURIX TC4x microcontroller. 🚗👨💻 Why? The growing demand for autonomous driving, ADAS, electrification and passenger comfort and entertainment calls for more computational power, functional safety and cybersecurity, making more advanced microcontrollers like the AURIX TC4x (plus intelligent software platforms that fit into the system development flow) mission-critical And the work has already shown results. 📈 ► Together, our embedded software team and Infineon worked with the lead customer, BMW, to achieve production-ready electronic control unit (ECU) software. ► Additionally, we at Siemens have also collaborated with the OEM to implement a cloud-based software development process for SDVs, using our advanced embedded software development tools. “Our collaboration with Infineon is long established and highly successful, providing leading automotive customers with advanced microcontrollers running AUTOSAR-based embedded software to help drive the future of the software defined vehicle industry,” said Frances Evans , our senior vice president, Lifecycle Collaboration Software. “The first production ready implementation of the AURIX TC4x demonstrates how a more consolidated, holistic approach helps the SDV industry to deliver the advanced features customers demand.” “Infineon has contributed to the AUTOSAR standard since 2004 and provides AUTOSAR solutions for its microcontroller portfolio like the AURIX TC4x,” said Thomas Schneid, Senior Director Software, Partnership and Ecosystem Management at Infineon. “Our collaboration with Siemens Digital Industries Software focuses on delivering advanced microcontrollers equipped with AUTOSAR-based embedded software to empower OEMs in driving the future of the software-defined vehicle." Our newsroom has more insight - check the comments for a direct link. #SDV #Automotive

We are thrilled to announce that the Call for Speakers program is now open for Siemens EDA User2User events! This is a unique opportunity to share your story. We are seeking highly technical presentations from like-minded engineers who are at the forefront of digital transformation. Join us to connect with fellow EDA experts and showcase your expertise. We invite you to submit your topic on a range of subjects, including: • Functional Design & Verification • Design Solutions & Power Integrity Analysis • Hardware Assisted Verification • High Level Synthesis • Custom IC • Low Power • Digital IC • AI/ML • Functional Safety, Security, Trust & Assurance • Cloud Adoption • Test and Embedded Analytics Solutions • PCB • 3DIC/Chiplet Design Don't miss this chance to highlight your innovative work and contribute to the advancement of our industry. Submit your proposal today and be a part of an inspiring community of EDA professionals- link is in the comments!

We are so proud and excited to congratulate our own Karen Donlan , Paula Giglio and Erin Giese as they ring the closing bell at the #NASDAQ today along with Jodi Shelton , CEO of the Global Semiconductor Alliance (GSA), and founder of its Women’s Leadership Initiative (WLI). What a fantastic opportunity to celebrate the valuable efforts and contributions of women in semiconductors. Brava! 👏👏👏

Are you ready for the next generation AI-enhanced Electronic Systems Design software? We are! 🎉 The latest advancement in our electronic systems design portfolio is here to bring you a unified user experience that delivers cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design through an integrated and multidisciplinary approach. "We are thrilled to announce the release of our next-generation electronic systems design solution, tailored to meet the critical needs of today's electronics engineers and the wider engineering community," said AJ Incorvaia , our senior vice president, Electronic Board Systems. "This release represents our most thoroughly vetted solution to date, incorporating feedback from hundreds of participants. By unifying the Xpedition, HyperLynx, and PADS Pro environments and infusing this with AI, our customers will be ready to tackle their challenges head-on." Focused on providing highly intuitive tools to overcome talent shortages and enable engineers to quickly adapt with minimal learning curves, the next generation toolset adds predictive engineering and new support assistance using AI, enhancing engineers’ capabilities, streamlining, and optimizing their workflows. Cloud connectivity will facilitate collaboration across the value chain and provide access to specialized services and resources, enabling engineers to rapidly adapt to changing requirements, supply chain insights and easier collaboration with stakeholders, regardless of location. The next generation software also brings enhanced integration with Siemens’ Teamcenter software for product lifecycle management and NX software for product engineering, allowing for multi-BOM support and tighter collaboration between ECAD and MCAD domains. To prioritize security, it offers rigid data access restrictions that can be configured and geo-located, while adhering to the strictest industry protocols. Siemens maintains partnerships with industry-leading cloud providers to ensure robust security measures. The solution also includes design and verification requirements management for model-based systems engineering support. Additional details can be found in our newsroom -- here: https://sie.ag/8AA1W #News #AI #PCBDesign #Innovation

Today we're happy to announce the Innexis product suite, a complement to our industry leading Veloce hardware-assisted verification and validation system. Building on the success and rapid adoption of Veloce, Innexis delivers a set of products and capabilities to address customer demand for shift-left software in the early phases of IC development. These products include: ► a hardware/software development flow from virtual to hybrid to full RTL ► an architecture native virtual platform for early high-speed software development ► a simulation backplane that enables the development of digital twins in our PAVE360™ software for software-defined vehicles and other complex systems. “The complexity of integrated circuits ( #IC ) is increasing exponentially, designers need more efficient methodologies to meet industry demands. Veloce has seen rapid adoption by industry leaders to help solve this critical bottleneck. The Innexis product suite extends workflow improvements from Veloce to help our customers shift left their IC development and debug cycle,” said Jean-Marie Brunet , our vice president and general manager, Hardware-Assisted Verification. “This enables IC design to begin months before final RTL, all while using a common software workload across the development process.” What are customers saying? 📣“The implementation of Innexis Hybrid in our development process has significantly enhanced software and system validation performance, thereby improving the efficiency of our teams and projects. By enabling heterogeneous component modeling within virtual platforms, it allows us to create realistic high-speed models of System on Chips (SoCs),” said Ari Hautala , Principal System Architect, Nokia Mobile Networks. “Furthermore, the integration of these high-speed virtual platforms with RTL IP on Veloce emulators facilitates superior overall performance while still permitting precise cycle-accurate performance and power analysis on RTL model components. Additionally, the Innexis hybrid environment offers exceptional visibility and debuggability for the SoC design, along with the capability to integrate and execute a large number of complex test cases effectively.” Our newsroom has all the details - direct link in comments. #ICVerification #IntegratedCircuits #EDA

We are excited to introduce the new Tessent In-System Test software, a groundbreaking design-for-test (DFT) solution that enhances in-system test capabilities for next generation integrated circuits (ICs). “Tessent In-System Test is a major step forward in helping our customers achieve their Silicon Lifecycle Management goals,” said Ankur Gupta , our senior vice president and general manager, Digital Design Creation Platform. “Aging and environmental factors are impacting today’s designs at a greater rate. Tessent In-System Test delivers smart solutions that address these challenges, ultimately providing customers improved performance, security and productivity.” Highlights 📣 » Tessent In-System Test is the industry's first in-system test controller designed specifically to work with Siemens’ industry-leading Tessent Streaming Scan Network software, enabling customers to apply embedded deterministic test patterns in-system throughout a product's lifecycle, and keep their ICs and the applications they power reliable, secure and fully functional. » Tessent In-System Test software is engineered to address critical challenges like aging and environmental factors, which can lead to Silent Data Corruption or Errors (SDC/SDE) » Tessent In-System Test enables customers to reuse existing IJTAG- and SSN-based patterns for in-system applications while improving overall chip planning and reducing test time »Tessent In-System Test allows for seamless integration of deterministic test patterns generated with Siemens' Tessent™ TestKompress™ software, and enables customers to embed deterministic test patterns generated using Tessent TestKompress with Tessent SSN directly to the in-system test controller via industry-standard APB or AXI bus interfaces, providing the highest level of test quality within a pre-defined test window, as well as the ability to change test content as devices mature or age through their lifecycle. In-system test with embedded deterministic patterns also supports re-use of existing test infrastructure. These capabilities are particularly key for industries focused on safety-critical applications such as the automotive, aerospace, and medical devices spaces. What users are saying 📣 “Tessent In-System Test technology allows us to reuse our extensive test infrastructure and patterns already utilized in our manufacturing tests for our data center fleet,” said Dan Trock, senior DFT manager at Amazon Web Services (AWS) . “This enables high-quality in-field testing of our data centers. Continuous monitoring of silicon devices throughout their lifecycle helps to ensure AWS customers benefit from infrastructure and services of the highest quality and reliability.” To learn more please visit our newsroom (link in comments). #IC #IntegratedCircuitDesign #Tessent