About

Wei Yao is a highly experienced Senior Staff Engineer with a proven track record of success in the technology industry. Currently working at Qualcomm, Wei has gained extensive knowledge and expertise in the field of electronic packaging engineering. Wei's career began at Broadcom, where he worked as a Staff Electronic Packaging Engineer. During his time at Broadcom, Wei developed a deep understanding of electronic packaging design and manufacturing processes. He then moved on to work for Qorvo, Inc. as a Staff Packaging Engineer, where he honed his skills in package design and development. Wei's educational background includes a Bachelor's degree from the University at Buffalo, where he studied Electrical Engineering. Throughout his academic career, Wei demonstrated a strong aptitude for problem-solving and analytical thinking, which have proven to be invaluable skills in his professional life. With over 7 years of relevant experience in the industry, Wei is a highly skilled engineer with a strong work ethic and a commitment to excellence. He is a dedicated team player who is able to collaborate effectively with colleagues and stakeholders at all levels of an organization. Wei's expertise in electronic packaging engineering makes him a valuable asset to any organization in the technology industry. His ability to design and develop innovative packaging solutions has helped to drive the success of the companies he has worked for, and he is always looking for new ways to improve processes and deliver outstanding results.